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Effects of the grain size and orientation of Cu on the formation and growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints
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173
Metallurgical reactions and high-temperature long-term reliability of the Sn-2.3Ag flip-chip solder bump
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174
Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering
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175
Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability
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Impact of bonding methods and surface finishes on terminal-substrate reliability in EV power modules
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Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints
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178
Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn-3.0Ag-0.5Cu composite solder preform
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179
Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints
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180
Transient liquid phase bonding using Cu foam and Cu-Sn paste for high-temperature applications
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