발행물

전체 논문

398

181

Microstructures and mechanical properties of ultrasonic-welded Cu-Cu joints for power module terminals in electric vehicles
윤정원, 김현태
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202310

182

A comparative study of laser soldering and reflow soldering using Sn-58Bi solder/Cu joints
윤정원, 정민성, 허민행, 김정수
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202310

183

Comparative study of solder size and volume effect on properties of Sn-3.0Ag-0.5Cu joints during isothermal aging
윤정원, 서영진, 허민행, 노은채
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202306

184

Novel and fast transient liquid phase bonding using etched Cu foam/Sn-3.0Ag-0.5Cu composite solder preform
윤정원, 허민행, 서영진
MATERIALS TODAY COMMUNICATIONS, 202306

185

Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding
윤정원, 김현태
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 202305

186

Comparative study of laser- and reflow-soldered Sn-3.0Ag-0.5Cu joints on thin Au/Pd/Ni(P) substrate
윤정원, 이동환, 정민성
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202301

187

Reliability of laser soldering using low melting temperature eutectic Sn-Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad
윤정원, 정민성, 이동환, 김현태
MATERIALS CHARACTERIZATION, 202212

188

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints
윤정원, 서영진
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202207

189

Effects of shear test temperatures and conditions on mechanical properties of Sn-Ag flip-chip solder bumps
정민성, 이동환, 허민행, 윤정원
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202205

190

Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints
이동환, 정민성, 윤정원
JOURNAL OF ALLOYS AND COMPOUNDS, 202205