발행물

전체 논문

398

141

Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni BGA joint with reflow time
Jeong-Won Yoon, Seung-Boo Jung
Zeitschrift fur Metallkunde, 2005.12

142

Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate
Chang-Yong Lee, Jeong-Won Yoon, Young-Jig Kim, Seung-Boo Jung
Microelectronic Engineering, 2005.12

143

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging
Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung
Materials Transactions, 2005.11

144

Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer during Reflow Reaction
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2005.06

145

IMC morphology, Interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Journal of Alloys and Compounds, 2005.04

146

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Materials Science Forum, 2005

147

Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Journal of Alloys and Compounds, 2005.04

148

Effect of Reflow Time on Interfacial Reaction and Shear Strength of Sn-0.7Cu solder/Cu and electroless Ni-P BGA Joints
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Journal of Alloys and Compounds, 2004.12

149

Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate
Jeong-Won Yoon, Young-Ho Lee, Dae-Gon Kim, Han-Byul Kang, Su-Jeong Suh, Cheol-Woong Yang, Chang-Bae Lee, Jong-Man Jung, Choong-Sik Yoo, Seung-Boo Jung
Journal of Alloys and Compounds, 2004.11

150

Interfacial Reactions and Shear Strengths between Sn-Ag based Pb-Free Solder Balls and Au/EN/Cu Metallization
Sang-Won Kim, Jeong-Won Yoon, Seung-Boo Jung
Journal of Electronic Materials, 2004.10