발행물

전체 논문

398

131

Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
Jeong-Won Yoon, Seung-Boo Jung
Microelectronic Engineering, 2006.11

132

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging
Jeong-Won Yoon, Seung-Boo Jung
Advanced Materials Research, 2006

133

Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
Jeong-Won Yoon, Seung-Boo Jung
Journal of Materials Research, 2006.06

134

Effects of reflow and cooling conditions on Interfacial Reaction and IMC morphology of Sn-Cu/Ni solder joint
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Journal of Alloys and Compounds, 2006.05

135

High Temperature Reliability and Interfacial Reaction of Eutectic Sn-0.7Cu/Ni Solder Joints during Isothermal Aging
Jeong-Won Yoon, Seung-Boo Jung
Microelectronics Reliability, 2006.05

136

Characteristic Analysis of Electroless Ni Plating layer for Electronic Packaging
Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae-Lee, Seung-Boo Jung
Surface and Interface Analysis, 2006.04

137

Interfacial Reactions between In-48Sn Solder and Electroless Nickel/Immersion Gold Substrate during Reflow Process
Ja-Myeong Koo, Jeong-Won Yoon, Seung-Boo Jung
Surface and Interface Analysis, 2006.04

138

Effect of Isothermal Aging on the Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer
Jeong-Won Yoon, Seung-Boo Jung
Surface and Coatings Technology, 2006.04

139

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
Jeong-Won Yoon, Seung-Boo Jung
Materials Science Forum, 2006.03

140

Reliability Studies of Sn-9Zn/Cu Solder Joints with Aging Treatment
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2006