Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn-Ag-Cu/Cu joints
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192
Intermetallic compound transformation and mechanical strength of Ni-Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202203
193
Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications
백종훈, 윤정원
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202201
194
High-temperature stability of Ni-Sn intermetallic joints for power device packaging
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JOURNAL OF ALLOYS AND COMPOUNDS, 202201
195
Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn-3.0Ag-0.5Cu solder joints under isothermal aging
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202110
196
Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn-3.0Ag-0.5Cu solder joints during current-stressing
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JOURNAL OF ALLOYS AND COMPOUNDS, 202101
197
Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn-58Bi solder joints during aging
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202011
198
Fast formation of Ni-Sn intermetallic joints using Ni-Sn paste for high-temperature bonding applications
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 202009
199
Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications
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APPLIED SURFACE SCIENCE, 202006
200
Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn-58Bi solder joint