Interfacial reactions and mechanical properties of Sn-3.0Ag-0.5Cu solder with pure Pd or Pd(P) layers containing thin-Au/Pd/Ni(P) surface-finished PCBs during aging
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Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications
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Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints
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APPLIED SURFACE SCIENCE, 202002
204
Nickel-tin transient liquid phase sintering with high bonding strength for high-temperature power applications
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201911
205
Optimal Ni(P) thickness and reliability evaluation of thin-Au/Pd(P)/Ni(P) surface-finish with Sn-3.0Ag-0.5Cu solder joints
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JOURNAL OF ALLOYS AND COMPOUNDS, 201910
206
Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag-0.5Cu solder joints during aging
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JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201907
207
Initial interfacial reactions of Ag/In/Ag and Au/In/Au joints during transient liquid phase bonding
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MICROELECTRONIC ENGINEERING, 201812
208
Effect of Sintering Conditions on the Mechanical Strength of Cu-Sintered Joints for High-Power Applications
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MATERIALS, 201811
209
Sequential interfacial reactions of SAC305 solder joints with thin ENEPIG surface finishes
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SURFACE AND INTERFACE ANALYSIS, 201811
210
Effect of surface finish metallization on mechanical strength of Ag sintered joint