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전체 논문

398

221

Board Level Drop Reliability of Epoxy-Containing Sn-58 mass% Bi Solder Joints with Various Surface Finishes
윤정원, 이상민, 정승부
MATERIALS TRANSACTIONS, 201603

222

Electromigration effect on Sn-58 % Bi solder joints with various substrate metallizations under current stress
윤정원, 이상민, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201602

223

Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints
윤정원, 방정환, 이창우, 정승부
JOURNAL OF ALLOYS AND COMPOUNDS, 201504

224

Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions
윤정원, 이상민, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201503

225

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
윤정원, 노보인, 정승부
MICROELECTRONICS RELIABILITY, 201402

226

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
윤정원, 고민관, 노보인, 정승부
MICROELECTRONICS RELIABILITY, 201312

227

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder
윤정원, 노보인, 김광석, 강사윤, 정승부
MICROELECTRONIC ENGINEERING, 201303

228

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
윤정원, 조일제, 안지혁, 신영의, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201208

229

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders
윤정원, 이종근, 이종범, 노보인, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201201

230

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold Surface Finish
윤정원, Q.V. Bui, N.D. Nam, 최돈현, A. Kar, 김정구, 정승부
JOURNAL OF ELECTRONIC MATERIALS, 201109