발행물

전체 논문

398

281

Morphology, thermal stability and solderability of electroless nickel-phosphorus plating layer
윤정원
Surface Review and Letters - 직접입력, 200708

282

Solid-state interfacial reactions between Sn-3.5Ag-0.7Cu solder and electroless Ni-immersion Au substrate during high temperature storage test
윤정원
Journal of Alloys and Compounds - 직접입력, 200707

283

Au-Sn Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
윤정원
Microsystem Technologies - 직접입력, 200707

284

Investigation of interfacial reactions between eutectic Sn-3.5Ag solder and ENIG-plated Cu substrate during aging at high temperature
윤정원
Journal of Materials Science: Materials in Electronics - 직접입력, 200705

285

Reliability analysis of Au-Sn flip-chip solder bump fabricated by co-electroplating
윤정원
Journal of Materials Research - 직접입력, 200705

286

Characterization of failure behaviors in anisotropic conductive interconnection
윤정원
Materials Transactions - 직접입력, 200705

287

Microstructural evolution of Sn-rich Au-Sn/Ni flip chip solder joints under high temperature storage testing condition
윤정원
Scripta Materialia - 직접입력, 200704

288

Solder joint reliability evaluation of Sn-Zn/Au/Ni/Cu ball-grid-array package during aging
윤정원
Materials Science & Engineering A - 직접입력, 200704

289

Effect of High Temperature Storage Test on Reliability of Eutectic Sn-Cu/ENIG Solder Joint
윤정원
Materials Science and Technology - 직접입력, 200704

290

전자 패키징의 플립칩 본딩 기술과 신뢰성
윤정원
대한용접접합학회지, 200704