발행물

전체 논문

398

241

Effects of different kinds of underfills and temperature-humidity treatments on drop reliability of board-level packages
Noh, B.-I., Yoon, J.-W., Ha, S.-O., Jung, S.-B.
Journal of Electronic Materials, 201102

242

Microstructure, electrical properties, and electrochemical migration of a directly printed ag pattern
Noh, B.-I., Yoon, J.-W., Kim, K.-S., Lee, Y.-C., Jung, S.-B.
Journal of Electronic Materials, 201101

243

Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar
Yoon, J.-W., Noh, B.-I., Jung, S.-B.
Journal of Materials Science: Materials in Electronics, 201101

244

Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joint
Kang, HB, Bae, JH, Yoon, JW, Jung, SB, Park, J, Yang, CW
SCRIPTA MATERIALIA, 201011

245

Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints
Yoon JW (Yoon, Jeong-Won), Noh BI (Noh, Bo-In), Jung SB (Jung, Seung-Boo)
JOURNAL OF ALLOYS AND COMPOUNDS, 201009

246

Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
Noh BI (Noh, Bo-In), Choi JH (Choi, Jung-Hyun), Yoon JW (Yoon, Jeong-Won), Jung SB (Jung, Seung-Boo)
JOURNAL OF ALLOYS AND COMPOUNDS, 201006

247

Mechanical Reliability of Sn-Ag BGA Solder Joints with Various Electroless Ni-P and Ni-B Plating Layers
Yoon, JW, Noh, BI, Jung, SB
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 201003

248

Comparison of Interfacial Stability of Pb-Free Solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-0.7Cu) on ENIG-Plated Cu During Aging
Yoon, JW, Noh, BI, Jung, SB
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 201003

249

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package
Ha, SS, Jang, JK, Ha, SO, Yoon, JW, Lee, HJ, Joo, JH, Kim, YH, Jung, SB
MICROELECTRONIC ENGINEERING, 201003

250

Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
Noh, BI, Yoon, JW, Choi, JH, Jung, SB
MATERIALS TRANSACTIONS, 201001