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전체 논문

398

251

Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer
Noh, BI, Yoon, JW, Jung, SB
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 201001

252

Interfacial reaction and mechanical reliability of eutectic Sn-0.7Cu/immersion Ag-plated Cu solder joint
Yoon, JW, Jung, SB
MATERIALS SCIENCE AND TECHNOLOGY, 200912

253

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test
Ha, SS, Jang, JK, Ha, SO, Kim, JW, Yoon, JW, Kim, BW, Park, SK, Jung, SB
JOURNAL OF ELECTRONIC MATERIALS, 200912

254

Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package
Noh, BI, Yoon, JW, Jung, SB
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 200909

255

Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness
Noh, BI, Yoon, JW, Lee, BY, Jung, SB
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 200909

256

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test
Noh, BI, Yoon, JW, Kim, JW, Lee, JB, Park, NC, Hong, WS, Jung, SB
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 200909

257

Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes
Noh, BI, Yoon, JW, Hong, WS, Jung, SB
JOURNAL OF ELECTRONIC MATERIALS, 200906

258

Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint
Yoon JW (Yoon, Jeong-Won), Chun HS (Chun, Hyun-Suk), Jung SB (Jung, Seung-Boo)
JOURNAL OF ALLOYS AND COMPOUNDS, 200902

259

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints
Kang, HB, Bae, JH, Lee, JW, Park, MH, Lee, YC, Yoon, JW, Jung, SB, Yang, CW
SCRIPTA MATERIALIA, 200902

260

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density
Ha, SS, Kim, JW, Yoon, JW, Ha, SO, Jung, SB
JOURNAL OF ELECTRONIC MATERIALS, 200901