발행물

전체 논문

398

271

TEM Study on Interfacial Reaction Layers Formed between Sn-3.5Ag Solder and Electroless Ni-Immersion Au Substrate
윤정원
Journal of Electronic Materials - 직접입력, 200801

272

Reliability evaluation of Au-20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au
윤정원
Materials Science & Engineering A - 직접입력, 200801

273

Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder
Yoon, JW, Koo, JM, Kim, JW, Ha, SS, Noh, BI, Lee, CY, Park, JH, Shur, CC, Jung, SB
JOURNAL OF ALLOYS AND COMPOUNDS, 2008

274

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구
윤정원
대한용접접합학회지, 200712

275

Investigation of interfacial reaction between Au-Sn solder and Kovar for hermetic sealing application
윤정원
Microelectronic Engineering - 직접입력, 200711

276

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
윤정원
Microelectronic Engineering - 직접입력, 200711

277

Reliability of Nickel Flip Chip Bump with Tin-Silver Encapsulation on Copper/Tin-Silver Substrate during Bonding Process
윤정원
Microelectronic Engineering - 직접입력, 200711

278

Fabrication of Ni Metal Mask with Fine Pitch by Electroforming Process
윤정원
Journal of Electronic Materials - 직접입력, 200711

279

Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents
윤정원
Microelectronic Engineering - 직접입력, 200711

280

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging
윤정원
Journal of Materials Research - 직접입력, 200710