발행물

전체 논문

398

291

Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150℃
윤정원
Journal of Materials Research - 직접입력, 200612

292

Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging
윤정원
Microelectronic Engineering - 직접입력, 200611

293

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint During Aging
윤정원
Advanced Materials Research - 직접입력, 200610

294

Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
윤정원
Journal of Materials Research - 직접입력, 200606

295

High Temperature Reliability and Interfacial Reaction of Eutectic Sn-0.7Cu/Ni Solder Joints during Isothermal Aging
윤정원
Microelectronics Reliability - 직접입력, 200605

296

Effects of reflow and cooling conditions on Interfacial Reaction and IMC morphology of Sn-Cu/Ni solder joint
윤정원
Journal of Alloys and Compounds - 직접입력, 200605

297

Effect of Isothermal Aging on the Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer
윤정원
Surface and Coatings Technology - 직접입력, 200604

298

Interfacial Reactions between In-48Sn Solder and Electroless Nickel/Immersion Gold Substrate during Reflow Process
윤정원
Surface and Interface Analysis - 직접입력, 200604

299

Characteristic Analysis of Electroless Ni Plating layer for Electronic Packaging
윤정원
Surface and Interface Analysis - 직접입력, 200604

300

TEM Observation of Interfacial Reaction Layers Formed Between Pb(Lead)-Free Sn-3.5Ag Solder and ENIG Plated Cu Substrate
윤정원
Materials Science Forum - 직접입력, 200603