발행물

전체 논문

398

301

Reliability Studies of Sn-9Zn/Cu Solder Joints with Aging Treatment
윤정원
Journal of Alloys and Compounds - 직접입력, 200601

302

Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate
윤정원
Microelectronic Engineering - 직접입력, 200512

303

Interfacial reaction and shear strength of Sn-0.7Cu solder/electrolytic Ni BGA joint with reflow time
윤정원
Zeitschrift fur Metallkunde - 직접입력, 200512

304

BGA 패키지의 기계적ㆍ전기적 특성 평가 및 평가법
윤정원
마이크로전자 및 패키징 학회지, 200512

305

Interfacial Reaction and Mechanical Characterization of Eutectic Sn-Zn/ENIG Solder Joints during Reflow and Aging
윤정원
Materials Transactions - 직접입력, 200511

306

Interfacial Reactions between Sn-0.4Cu Solder and Cu Substrate with or without ENIG Plating Layer during Reflow Reaction
윤정원
Journal of Alloys and Compounds - 직접입력, 200506

307

Interfacial reaction and mechanical properties of eutectic Sn-0.7Cu/Ni BGA solder joints during isothermal long-term aging
윤정원
Journal of Alloys and Compounds - 직접입력, 200504

308

Interfacial Reaction and Shear Strength of Pb-Free Sn-3.5Ag/Ni BGA Solder Joints during Reflow
윤정원
Materials Science Forum - 직접입력, 200504

309

IMC morphology, Interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate
윤정원
Journal of Alloys and Compounds - 직접입력, 200504

310

전자 패키징의 요소기술
윤정원
대한용접학회지, 200504