발행물

전체 논문

398

341

Sn-3.0Ag-0.5Cu 솔더 접합부의 계면반응과 취성파괴율에 미치는 Thin ENEPIG 도금두께의 영향 (Effect of thin ENEPIG plating thickness on interfacial reaction and brittle fracture rate of Sn-3.0Ag-0.5Cu solder joints)
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
대한용접접합학회지(Journal of Welding and Joining), 2018.10

342

태양광 접속함 정션박스 모듈 적용을 위한 Sn-3.0Ag-0.5Cu 및 Sn-1.0Ag-0.7Cu-1.6Bi-0.2In 솔더링의 공정최적화 (Optimization of Soldering Process of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.7Cu-1.6Bi-0.2In Alloys for Solar Combiner Junction Box Module)
Byung-Suk Lee, Chul-Min Oh, Hyun Kwak, Tae-Woo Kim, Heui-Bog Yun, Jeong-Won Yoon
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2018.09

343

0.1 ㎛ Ni두께를 가지는 얇은 ENEPIG 층과 Sn-3.0Ag-0.5Cu 솔더와의 계면반응 및 접합강도 (Interfacial reactions and mechanical strength of SAC305/0.1㎛-Ni thin ENEPIG solder joints)
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
대한용접접합학회지(Journal of Welding and Joining), 2017.12

344

자동차 전력반도체 모듈 적용을 위한 Sb계 무연 솔더의 열화 특성 (Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module)
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
대한용접접합학회지(Journal of Welding and Joining), 2017.10

345

ENEPIG/Sn-Ag-Cu 솔더 접합부의 취성 파괴에 미치는 무전해 니켈 도금액의 영향 (Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint)
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo
대한용접접합학회지(Journal of Welding and Joining), 2017.06

346

미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성 (Solderability of thin ENEPIG plating layer for fine pitch package application)
Jong-Hoon Back, Byung-Suk Lee, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2017.03

347

자동차 전장용 무연솔더 및 솔더 접합부의 신뢰성 평가 (Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint)
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
대한용접접합학회지(Journal of Welding and Joining), 2016.02

348

전기자동차용 고신뢰성 파워모듈 패키징 기술 (Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications)
Jeong-Won Yoon, Jung-Hwan Bang, Yong-Ho Ko, Se-Hoon Yoo, Jun-Ki Kim, Chang-Woo Lee
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2014.12

349

LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 열처리의 영향 (Effect of Heat Treatment on Mechanical Reliability of Solder Joints in LED Package)
Min-Kwan Ko, Jee-Hyuk Ahn, Young-Chul Lee, Kwang-Seok Kim, Jeong-Won Yoon, Seung-Boo Jung
대한금속ᆞ재료학회지 (Korean. J. Met. Mater.), 2012

350

솔더 접합부에 생성된 Void의 JEDEC 규격과 기계적 특성에 미치는 영향 (Analysis of Void Effects on Mechanical Property of BGA Solder Joint)
Jong-Gun Lee, Kwang-Seok Kim, Jeong-Won Yoon, Seung-Boo Jung
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2011