발행물

전체 논문

398

351

열압착법을 이용한 경ㆍ연성 인쇄회로기판 접합부의 접합 강도에 미치는 접합 조건의 영향 (Effects of Bonding Conditions on Joint Property between FPCB and RPCB using Thermo-Compression Bonding Method)
Jong-Gun Lee, Min-Kwan Ko, Jong-Bum Lee, Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2011

352

LED 패키지 솔더 접합부의 기계적 신뢰성에 미치는 리플로우 횟수의 영향 (Effect of Multiple Reflows on the Mechanical Reliability of Solder Joint in LED Package)
Young-Chul Lee, Kwang-Seok Kim, Ji-Hyuk Ahn, Jeong-Won Yoon, Min-Kwan Ko, Seung-Boo Jung
대한금속ᆞ재료학회지 (Kor. J. Met. Mater.), 2010

353

Sn-Pb 솔더를 이용한 경연성 인쇄 회로 기판간의 열압착 본딩 (Thermo-compression Bonding of Electrodes between RPCB and FPCB using Sn-Pb Solder)
Jung-Hyun Choi, Jong-Gun Lee, Jeong-Won Yoon, Seung-Boo Jung
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2010

354

전자 패키징의 전기적 특성평가 (Electrical characterization of electronic package)
Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 2008.02

355

플립칩 패키징을 위한 초음파 접합 기술 (Ultrasonic Bonding Technology for Flip Chip Packaging)
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, Seung-Boo Jung
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 2008.02

356

Optoelectronic 패키징을 위한 Au-Sn 플립칩 범핑 기술과 신뢰성 (Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging)
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 2008.02

357

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구 (Study on Wettability of Sn-Xwt%Cu Solder)
Bo-In Noh, Jeong-Won Yoon, Bui Quoc Vu, Seung-Boo Jung
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 2007.12

358

전자 패키징의 플립칩 본딩 기술과 신뢰성 (Flip-chip Bonding Technology and Reliability of Electronic Packaging)
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung
대한용접접합학회지(Journal of the Korean Welding and Joining Society), 2007.04

359

BGA 패키지의 기계적ㆍ전기적 특성 평가 및 평가법 (Evaluation and Test Method Characterization for Mechanical and Electrical Properties in BGA Package)
Ja-Myeong Koo, Jong-Woong Kim, Dae-Gon Kim, Jeong-Won Yoon, Chang-Yong Lee, Seung-Boo Jung
마이크로전자 및 패키징 학회지(Journal of the Microelectronics & Packaging Society), 2005.12

360

전자 패키징의 요소기술 (Core Technology of Electronic Packaging)
Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung
대한용접학회지(Journal of the Korean Welding Society), 2005.04