발행물

전체 논문

398

321

Growth of an Intermetallic Compound Layer with Sn-3.5Ag-5Bi solder on Cu and Ni-P/Cu during Aging Treatment
윤정원
Journal of Electronic Materials - 직접입력, 200311

322

Growth Kinetics of IMC Formed between Sn-3.5Ag-0.75Cu BGA Solder and (Cu, immersion Au/electroless Ni-P/Cu) Substrate by Solid State Isothermal Aging
윤정원
3th International Symposium on Designing, Processing and Properties of Advanced Engineering Materials 발표논문집 - 직접입력, 200311

323

Investigation of interfacial reactions between Sn-5Bi solder and Cu Substrate
윤정원
Journal of Alloys and Compounds - 직접입력, 200309

324

Intermetallic Compound Layer Formation Between Sn-3.5 mass%Ag BGA Solder Ball and (Cu, Immersion Au/electroless Ni-P/Cu) Substrate
윤정원
Journal of Materials Science: Materials in Electronics - 직접입력, 200308

325

Activation Energies of Intermetallic Compound Growth at the Interface Between Sn-5Bi-3.5Ag solder and Cu substrate
윤정원
MATERIALS SCIENCE AND TECHNOLOGY - 직접입력, 200308

326

Investigation of interfacial reactions between Sn-Ag-Bi-In solder and (Cu, Electroless Ni-P/Cu) Substrate
윤정원
Zeitschrift fur Metallkunde - 직접입력, 200304

327

Reaction diffusions of Cu6Sn5 and Cu3Sn Intermetallic Compound in the couple of Sn-3.5Ag Eutectic Solder and Copper Substrate
윤정원
Metals and Materials International - 등재, 200304

328

Reaction Diffusion and Formation of Cu11In9 and In27Ni10 Phases in the Couple of Indium-Substrates
윤정원
Materials Transactions - 직접입력, 200301

329

Interfacial Reaction Between Sn-58Bi Eutectic Solder and (Cu, electroless Ni-P/Cu) substrate
윤정원
Materials Transactions - 직접입력, 200208

330

Sn-3.5Ag 공정 솔더의 젖음특성
윤정원
대한용접학회지, 200202