발행물

전체 논문

398

311

Effect of Reflow Time on Interfacial Reaction and Shear Strength of Sn-0.7Cu solder/Cu and electroless Ni-P BGA Joints
윤정원
Journal of Alloys and Compounds - 직접입력, 200412

312

Intermetallic compound layer growth at the interface between Sn-Cu-Ni solder and Cu substrate
윤정원, 0, 0, 0, 0, 0, 0, 0, 0, 0
Journal of Alloys and Compounds - 직접입력, 200411

313

Reliability Investigation and Interfacial Reaction on Lead-Free Sn-Cu/Ni BGA Package
윤정원
Journal of Electronic Materials - 직접입력, 200410

314

Interfacial Reactions and Shear Strengths between Sn-Ag based Pb-Free Solder Balls and Au/EN/Cu Metallization
윤정원
Journal of Electronic Materials - 직접입력, 200410

315

Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate
윤정원
Journal of Alloys and Compounds - 직접입력, 200408

316

Phase analysis and kinetics of solid-state aging of Pb-free Sn-3.5Ag solder on electroless Ni-P substrate
윤정원
Surface and Interface Analysis - 직접입력, 200408

317

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
윤정원
Journal of Materials Science - 직접입력, 200407

318

IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
윤정원
Materials Transactions - 직접입력, 200403

319

Growth kinetics of IMC formed between Sn-3.5Ag-0.75Cu BGA solder and electroless Ni-P/Cu substrate by solid-state isothermal aging
윤정원
Materials Science Forum - 직접입력, 200401

320

Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints
윤정원
Materials Science Forum - 직접입력, 200401