Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint
윤정원, 노보인, 정승부
JOURNAL OF ELECTRONIC MATERIALS, 201109
232
Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint
윤정원, 강한별, 배지환, 정승부, 박종우, 양철웅
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201109
233
Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits
윤정원, 노보인, 이보영, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201107
234
Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate
윤정원, 이영철, 안지혁, 김광석, 김종웅, 김용일, 정승부
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, 201107
235
Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu
윤정원, 노보인, 최정현, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201107
236
Fabrication and adhesion strength of Cu/Ni-Cr/polyimide films for flexible printed circuits
Noh, B.-I., Yoon, J.-W., Jung, S.-B.
Microelectronic Engineering, 201106
237
Effect of thermal treatment on adhesion strength of Cu/Ni-Cr/polyimide flexible copper clad laminate fabricated by roll-to-roll process
Noh, B.-I., Yoon, J.-W., Choi, J.-H., Jung, S.-B.
Microelectronic Engineering, 201105
238
Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint
Ha, S.-S., Sung, J.-Y., Yoon, J.-W., Jung, S.-B.
Microelectronic Engineering, 201105
239
In situ TEM characterization of interfacial reaction in Sn-3.5Ag/electroless Ni(P) solder joint