발행물

전체 논문

398

211

Sequential interfacial reactions of Au/In/Au transient liquid phase-bonded joints for power electronics applications
윤정원, 이병석
THIN SOLID FILMS, 201808

212

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition
윤정원, 방정환, 유동열, Ming Yang, 고용호, Hiroshi Nishikawa, 이창우
METALS, 201808

213

Comparative study of ENEPIG and thin ENEPIG as surface finishes for SAC305 solder joints
윤정원, 백종훈, 정승부
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201803

214

Cu-Sn Intermetallic Compound Joints for High-Temperature Power Electronics Applications
윤정원, 이병석
JOURNAL OF ELECTRONIC MATERIALS, 201801

215

Enhancement of Cu pillar bumps by electroless Ni plating
윤정원, 이병석, 장승부
MICROELECTRONIC ENGINEERING, 201708

216

Cu-Sn and Ni-Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
윤정원, 이병석, 현승균
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 201706

217

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
이창우, 유세훈, 김준기, 윤정원, 이병석, 고용호, 방정환
MICROELECTRONICS RELIABILITY, 201704

218

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
윤정원, 김경호, Junichi Koike, 유세훈
JOURNAL OF ELECTRONIC MATERIALS, 201612

219

Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications
윤정원, 이병석, 이창우
SURFACE AND INTERFACE ANALYSIS, 201607

220

Effect of Hygrothermal Treatment on Reliability of Thermo-Compression Bonded FPCB/RPCB Contact Joints
윤정원, 정승부
MATERIALS TRANSACTIONS, 201605