발행물

전체 논문

398

151

Reliability Investigation and Interfacial Reaction on Lead-Free Sn-Cu/Ni BGA Package
Jeong-Won Yoon, Sang-Won Kim, Ja-Myeong Koo, Dae-Gon Kim, Seung-Boo Jung
Journal of Electronic Materials, 2004.10

152

Phase analysis and kinetics of solid-state aging of Pb-free Sn-3.5Ag solder on electroless Ni-P substrate
Jeong-Won Yoon, Seung-Boo Jung
Surface and Interface Analysis, 2004.08

153

Growth kinetics of Ni3Sn4 and Ni3P layer between Sn-3.5Ag solder and electroless Ni-P substrate
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2004.08

154

Effect of isothermal aging on intermetallic compound layer growth at the interface between Sn-3.5Ag-0.75Cu solder and Cu substrate
Jeong-Won Yoon, Seung-Boo Jung
Journal of Materials Science, 2004.07

155

IMC Growth and Shear Strength of Sn-Ag-Bi-In/Au/Ni/Cu BGA Joints During Aging
Jeong-Won Yoon, Sang-Won Kim, Seung-Boo Jung
Materials Transactions, 2004.03

156

Influence of Shear Speed on the Shear Force of Eutectic Sn-Pb and Pb-Free BGA Solder Joints
Jong-Woong Kim, Jeong-Won Yoon, Seung-Boo Jung
Materials Science Forum, 2004

157

Growth kinetics of IMC formed between Sn-3.5Ag-0.75Cu BGA solder and electroless Ni-P/Cu substrate by solid-state isothermal aging
Jeong-Won Yoon, Chang-Bae Lee, Seung-Boo Jung
Materials Science Forum, 2004

158

Growth of an Intermetallic Compound Layer with Sn-3.5Ag-5Bi solder on Cu and Ni-P/Cu during Aging Treatment
Jeong-Won Yoon, Chang-Bae Lee, Seung-Boo Jung
Journal of Electronic Materials, 2003.11

159

Investigation of interfacial reactions between Sn-5Bi solder and Cu Substrate
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2003.09

160

Activation Energies of Intermetallic Compound Growth at the Interface Between Sn-5Bi-3.5Ag solder and Cu substrate
Jeong-Won Yoon, Chang-Bae Lee, Seung-Boo Jung
Materials Science and Technology, 2003.08