Mechanical Reliability Evaluation of Sn-37Pb Solder Joint Using High Speed Lap-shear Test
Seong-Jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung, Hoo-Jeong Lee
Microelectronic Engineering, 2008.10
105
Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder
Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur, Seung-Boo Jung
Journal of Alloys and Compounds, 2008.10
106
Thermal degradation of anisotropic conductive film joints under temperature fluctuation
Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park, Seung-Boo Jung
International Journal of Adhesion and Adhesives, 2008.09
107
Initial interfacial reaction layers formed in Sn-3.5Ag solder/electroless Ni-P plated Cu substrate system
Han-Byul Kang, Jae-Wook Lee, Jee-Hwan Bae, Min-Ho Park, Jeong-Won Yoon, Seung-Boo Jung, Jae-Seon Ju, Cheol-Woong Yang
Journal of Materials Research, 2008.08
108
Interfacial reactions and mechanical properties of In-48Sn solder joint with electroplated Au/Ni ball grid array (BGA) substrate after multiple reflows
Ja-Myeong Koo, Jeong-Won Yoon, Seung-Boo Jung
Journal of Materials Research, 2008.06
109
Effect of immersion Ag surface finish on interfacial reaction and mechanical reliability of Sn3.5Ag0.7Cu solder joint
Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2008.06
110
Correlation between Interfacial Reactions and Shear Strengths of Sn-Ag-(Cu and Bi-In)/ENIG plated Cu Solder Joints