발행물

전체 논문

398

91

Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joint using High-Speed Ball Shear Test
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim, Jeong-Won Yoon, Byung-Woo Kim, Sun-Kyu Park, Seung-Boo Jung
Journal of Electronic Materials, 2009.12

92

Interfacial reaction and mechanical reliability of eutectic Sn-0.7Cu/immersion Ag-plated Cu solder joint
Jeong-Won Yoon, Seung-Boo Jung
Materials Science and Technology, 2009.12

93

Wettability and interfacial reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu solder joints
Jeong-Won Yoon, Bo-In Noh, Bong-Kyun Kim, Chang-Chae Shur, Seung-Boo Jung
Journal of Alloys and Compounds, 2009.11

94

Effects of Underfill Materials and Thermal Cycling on Mechanical Reliability of Chip Scale Package
Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung
IEEE Transactions on Components and Packaging Technologies, 2009.09

95

Adhesion characteristics of Cu/Ni-Cr/polyimide flexible copper clad laminates according to Ni:Cr ratio and Cu electroplating layer thickness
Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2009.09

96

Reliability of Au bump flip chip packages with adhesive materials using four-point bending test
Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung
International Journal of Adhesion and Adhesives, 2009.09

97

Solder Joint Reliability in Flip Chip Package with Surface Treatment of ENIG under Thermal Shock Test
Sang-Su Ha, Sang-Ok Ha, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Sung-Jin Kim, Tae-Hwan Hong, Seung-Boo Jung
Metals and Materials International, 2009.08

98

Evaluation of electrochemical migration on flexible printed circuit boards with different surface finishes
Bo-In Noh, Jeong-Won Yoon, Won-Sik Hong, Seung-Boo Jung
Journal of Electronic Materials, 2009.06

99

Liquid-state and solid-state interfacial reactions of fluxless-bonded Au-20Sn/ENIG solder joint
Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung
Journal of Alloys and Compounds, 2009.02

100

Control of interfacial reaction layers formed in Sn-3.5Ag-0.7Cu/electroless Ni-P solder joints
Han-Byul Kang, Jee-Hwan Bae, Jae-Wook Lee, Min-Ho Park, Young-Chul Lee, Jeong-Won Yoon, Seung-Boo Jung, Cheol-Woong Yang
Scripta Materialia, 2009.02