Metallurgically and mechanically reliable microsilver sintered joints for automotive power module applications

High-temperature stability of Ni-Sn intermetallic joints for power device packaging

Comparative study of normal and thin Au/Pd/Ni(P) surface finishes with Sn-3.0Ag-0.5Cu solder joints under isothermal aging

Effect of Ni(P) thickness in Au/Pd/Ni(P) surface finish on the electrical reliability of Sn–3.0Ag–0.5Cu solder joints during current-stressing

Effects of Ni(P) layer thickness and Pd layer type in thin-Au/Pd/Ni(P) surface finishes on interfacial reactions and mechanical strength of Sn-58Bi solder joints during aging

Fast formation of Ni-Sn intermetallic joints using Ni-Sn paste for high-temperature bonding applications

Bonding of power device to ceramic substrate using Sn-coated Cu micro paste for high-temperature applications

Effects of a phosphorous-containing Pd layer in a thin-ENEPIG surface finish on the interfacial reactions and mechanical strength of a Sn–58Bi solder joint

Fast formation of Cu-Sn intermetallic joints using pre-annealed Sn/Cu/Sn composite preform for high-temperature bonding applications

Interfacial reactions and mechanical properties of Sn–3.0Ag–0.5Cu solder with pure Pd or Pd(P) layers containing thin‑Au/Pd/Ni(P) surface‑finished PCBs during aging