Effects of the grain size and orientation of Cu on the formation and growth behavior of intermetallic compounds in Sn-Ag-Cu solder joints
Da-Gyeong Han, Jeong-Won Yoon
Journal of Alloys and Compounds, 2025
52
Properties of Sn-3.0Ag-0.5Cu solder joints under various soldering conditions: Reflow vs. Laser vs. Intense Pulsed Light soldering
Eun-Chae Noh, Hyo-Won Lee, Jong-Woong Kim, Seung-Boo Jung, Jeong-Won Yoon
Journal of Materials Research and Technology, 2024.11
53
Photothermal effects on low-temperature hybrid solder joints and its superior drop reliability
Seahwan Kim, Kyung Deuk Min, Jeong-Won Yoon, Seung-Boo Jung
Materials Characterization, 2024.10
54
Impact of Bonding Methods and Surface Finishes on Terminal-Substrate Reliability in EV Power Modules
Hyeon-Tae Kim, Dong-Bok Lee, Kwan-Soo Lim, Ji-Hyung Lee, Semin Park, Chul-Min Oh, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2024.08
55
Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints
Hyeon-Tae Kim, Jeong-Won Yoon
Materials Today Communications, 2024.08
56
Evaluation of high-temperature long-term reliability of transient liquid phase bonded joints using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
Min-Haeng Heo, Young-Jin Seo, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2024.07
57
Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints
Eun-Chae Noh, Young-Jin Seo, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2023.11
58
Transient liquid phase bonding using Cu foam and Cu–Sn paste for high temperature applications
Min-Haeng Heo, Young-Jin Seo, Jeong-Won Yoon
Journal of Materials Research and Technology, 2023.11
59
Microstructures and mechanical properties of ultrasonic-welded Cu–Cu joints for power module terminals in electric vehicles
Hyeon-Tae Kim, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2023.10
60
A comparative study of laser soldering and reflow soldering using Sn–58Bi solder/Cu joints
Min-Seong Jeong, Min-Haeng Heo, Jungsoo Kim, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2023.10