발행물

전체 논문

398

21

Electromigration effect on Sn-58%Bi solder joints with various substrate metallizations under current stress
Sang-Min Lee, Jeong-Won Yoon, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2016.02

22

Interfacial reaction and intermetallic compound formation of Sn-1Ag/ENIG and Sn-1Ag/ENEPIG solder joints
Jeong-Won Yoon, Jung-Hwan Bang, Chang-Woo Lee, Seung-Boo Jung
Journal of Alloys and Compounds, 2015.04

23

Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions
Sang-Min Lee, Jeong-Won Yoon, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2015.03

24

Effect of rare earth metal Ce addition to Sn-Ag solder on interfacial reactions with Cu substrate
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Metals and Materials International, 2014.05

25

Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Microelectronics Reliability, 2014.02

26

Joint reliability evaluation of thermo-compression bonded FPCB/RPCB joints under high temperature storage test
Jeong-Won Yoon, Min-Kwan Ko, Bo-In Noh, Seung-Boo Jung
Microelectronics Reliability, 2013.12

27

Effects of Atmospheric Pressure Plasma Surface Treatments on the Patternability and Electrical Property of Screen-Printed Ag Nanopaste
Young-Chul Lee, Jong-Woong Kim, Jeong-Won Yoon, Cheol-Woong Yang, Yongil Kim, Seung-Boo Jung
Metals and Materials International, 2013.07

28

Electrochemical migration of directly printed Ag electrodes using Ag paste with epoxy binder
Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Sayoon Kang, Seung-Boo Jung
Microelectronic Engineering, 2013.03

29

Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
Ilje Cho, Jee-Hyuk Ahn, Jeong-Won Yoon, Young-Eui Shin, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2012.08

30

Effect of Gold Immersion Time on the Electrochemical Migration Property of Electroless Nickel/Immersion Gold Surface Finishing
Q.V. Bui, Jeong-Won Yoon, Seung-Boo Jung
Journal of Nanoscience and Nanotechnology, 2012