발행물

전체 논문

398

11

Cu-Sn Intermetallic Compound Joints for High-temperature Power Electronics Applications
Byung-Suk Lee, Jeong-Won Yoon
Journal of Electronic Materials, 2018

12

Die-Attach for Power Devices using the Ag Sintering Process: Interfacial Microstructure and Mechanical Strength
Byung-Suk Lee, Jeong-Won Yoon
Metals and Materials International, 2017.09

13

Enhancement of Cu pillar bumps by electroless Ni plating
Byung-Suk Lee, Seung-Boo Jung, Jeong-Won Yoon
Microelectronic Engineering, 2017.08

14

Cu-Sn and Ni-Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
Byung-Suk Lee, Soong-Keun Hyun, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2017.06

15

Bondability and Reliability of Multi-Chip Packages Bonded with Non-Conductive Paste Using Thermal Compression Energy and Ultrasonic Energy
J.G. Lee, J.B. Lee, W.R. Myung, J.W. Yoon, S.B. Jung
Journal of Nanoscience and Nanotechnology, 2017.05

16

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications
Byung-Suk Lee, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee, Sehoon Yoo, Jun-Ki Kim, Jeong-Won Yoon
Microelectronics Reliability, 2017.04

17

Effect of Plasma Surface Finish on Wettability and Mechanical Properties of SAC305 Solder Joints
Kyoung-Ho Kim, Junichi Koike, Jeong-Won Yoon, Sehoon Yoo
Journal of Electronic Materials, 2016.12

18

Comparative study of Au-Sn and Sn-Ag-Cu as die-attach materials for power electronics applications
Byung-Suk Lee, Chang-Woo Lee, Jeong-Won Yoon
Surface and Interface Analysis, 2016.07

19

Effect of hygrothermal treatment on reliability of thermo-compression bonded FPCB/RPCB contact joints
Jeong-Won Yoon, Seung-Boo Jung
Materials Transactions, 2016.05

20

Board Level Drop Reliability of Epoxy-Containing Sn-58mass% Bi Solder Joints with Various Surface Finishes
Sang-Min Lee, Jeong-Won Yoon, Seung-Boo Jung
Materials Transactions, 2016.03