Effects of different kinds of underfills and temperature humidity treatments on drop reliability of board level packages
Bo-In Noh, Jeong-Won Yoon, Sang-Ok Ha, Seung-Boo Jung
Journal of Electronic Materials, 2011.02
44
Interfacial reaction between Au-Sn solder and Au/Ni-metallized Kovar
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2011
45
Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern
Bo-In Noh, Jeong-Won Yoon, Kwang-Seok Kim, Young-Chul Lee, Seung-Boo Jung
Journal of Electronic Materials, 2011
46
Comparison of pressure-less Ag sinter-bonding properties with varying substrate surface finishes and Ag particle shapes and sizes: Influence of necking region and fracture behavior
Dong-Bok Lee, Jee-Yeon Park, Eun-Chae Noh, Chul-Min Oh, Jeong-Won Yoon
Journal of Materials Research and Technology, 2025.05
47
Transient Liquid-Phase Bonding using Sn/Ni/Sn Laminated Metal Preform for Power Device Packaging
Dong-Bok Lee, Young-Jin Seo, Jeong-Won Yoon
Journal of Electronic Materials, 2025.03
48
Metallurgical and mechanical properties of transient liquid phase bonded joints formed using Sn/Ni-foam hybrid preforms
Young-Jin Seo, Jeong-Won Yoon
Materials Chemistry and Physics, 2025.03
49
Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging