발행물

전체 논문

398

61

Comparative study of solder size and volume effect on properties of Sn-3.0Ag-0.5Cu joints during isothermal aging
Young-Jin Seo, Min-Haeng Heo, Eun-Chae Noh, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2023.06

62

Novel and fast transient liquid phase bonding using etched Cu foam/Sn–3.0Ag–0.5Cu composite solder preform
Min-Haeng Heo, Young-Jin Seo, Jeong-Won Yoon
Materials Today Communications, 2023.06

63

Microstructures and mechanical properties of ENIG/Sn-3.5Ag/ENIG joints formed by ultrasonic-assisted solder bonding
Hyeon-Tae Kim, Jeong-Won Yoon
Journal of Materials Research and Technology, 2023.05

64

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin-Au/Pd/Ni(P) substrate
Dong-Hwan Lee, Min-Seong Jeong, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2023

65

Reliability of laser soldering using low melting temperature eutectic Sn-Bi solder and electroless Ni-electroless Pd-immersion Au-finished Cu pad
Min-Seong Jeong, Dong-Hwan Lee, Hyeon-Tae Kim, Jeong-Won Yoon
Materials Characterization, 2022.12

66

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints
Young-Jin Seo, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2022.07

67

Effects of shear test temperatures and conditions on mechanical properties of Sn-Ag flip-chip bump
Min-Haeng Heo, Dong-Hwan Lee, Min-Seong Jeong, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2022.05

68

Effect of temperature on shear properties of Sn-3.0Ag-0.5Cu and Sn-58Bi solder joints
Min-Seong Jeong, Dong-Hwan Lee, Jeong-Won Yoon
Journal of Alloys and Compounds, 2022.05

69

Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn-Ag-Cu/Cu joints
Dong-Hwan Lee, Min-Seong Jeong, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2022.04

70

Intermetallic compound transformation and mechanical strength of Ni-Sn transient liquid phase sinter-bonded joints in an extreme high-temperature environment
So-Eun Jeong, Jeong-Won Yoon
Journal of Materials Science: Materials in Electronics, 2022.03