발행물

전체 논문

398

81

Effects of crystalline and amorphous Pd layers on initial interfacial reactions at Sn-3.0Ag-0.5Cu/thin-Au/Pd/Ni(P) solder joints
Jungsoo Kim, Seung-Boo Jung, Jeong-Won Yoon
Applied Surface Science, 2020.02

82

Characterization of ternary Ni2SnP layer in Sn-3.5Ag-0.7Cu/electroless Ni (P) solder joint
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang
Scripta Materialia, 2010.11

83

Effect of Ni-Cr Seed Layer Thickness on the Adhesion Characteristics of Flexible Copper Clad Laminates Fabricated by a Roll-to-Roll Process
Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung
Metals and Materials International, 2010.10

84

Effects of third element and surface finish on interfacial reactions of Sn-Ag-xCu (or Ni)/(Cu or ENIG) solder joints
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Journal of Alloys and Compounds, 2010.09

85

Effects of cerium content on wettability, microstructure and mechanical properties of Sn-Ag-Ce solder alloys
Bo-In Noh, Jung-Hyun Choi, Jeong-Won Yoon, Seung-Boo Jung
Journal of Alloys and Compounds, 2010.06

86

Mechanical reliability of Sn-Ag BGA solder joints with various electroless Ni-P and Ni-B plating layers
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
IEEE Transactions on Components and Packaging Technologies, 2010.03

87

Comparison of interfacial stability of Pb-free solders (Sn-3.5Ag, Sn-3.5Ag-0.7Cu and Sn-0.7Cu) on ENIG-plated Cu during aging
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
IEEE Transactions on Components and Packaging Technologies, 2010.03

88

Effect of multiple reflows on interfacial reaction and shear strength of Sn-Ag electroplated solder bumps for flip chip package
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jeong-Won Yoon, Hoo-Jeong Lee, Jin-Ho Joo, Young-Ho Kim, Seung-Boo Jung
Microelectronic Engineering, 2010.03

89

Effect of Cr Thickness on Adhesion Strength of Cu/Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
Bo-In Noh, Jeong-Won Yoon, Jung-Hyun Choi, Seung-Boo Jung
Materials Transactions, 2010

90

Effect of laminating parameters on the adhesion property of flexible copper clad laminate with adhesive layer
Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung
International Journal of Adhesion and Adhesives, 2010