발행물

전체 논문

398

31

Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders
Jeong-Won Yoon, Jong-Gun Lee, Jong-Bum Lee, Bo-In Noh, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2012

32

Microstructure of interfacial reaction layer in Sn-Ag-Cu/electroless Ni (P) solder joint
Han-Byul Kang, Jee-Hwan Bae, Jeong-Won Yoon, Seung-Boo Jung, Jongwoo Park, Cheol-Woong Yang
Journal of Materials Science: Materials in Electronics, 2011.09

33

Comparative study of ENIG and ENEPIG as surface finishes for a Sn-Ag-Cu solder joint
Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
Journal of Electronic Materials, 2011.09

34

Effect of Gold on the Corrosion Behavior of an Electroless Nickel/Immersion Gold surface finish
Q.V. Bui, N.D. Nam, J. W. Yoon, D.H. Choi, A. Kar, J.G. Kim, S.B. Jung
Journal of Electronic Materials, 2011.09

35

Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate
Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, Jeong-Won Yoon, Jong-Woong Kim, Yongil Kim, Seung-Boo Jung
Journal of Nanoscience and Nanotechnology, 2011.07

36

Effects of different kinds of seed layers and heat treatment on adhesion characteristics of Cu/(Cr or Ni-Cr)/PI interfaces in flexible printed circuits
Bo-In Noh, Jeong-Won Yoon, Bo-Young Lee, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2011.07

37

Effect of adding Ce on interfacial reactions between Sn-Ag solder and Cu
Jeong-Won Yoon, Bo-In Noh, Jung-Hyun Choi, Seung-Boo Jung
Journal of Materials Science: Materials in Electronics, 2011.07

38

Fabrication and adhesion strength of Cu/Ni-Cr/polyimide films for flexible printed circuits
Bo-In Noh, Jeong-Won Yoon, Seung-Boo Jung
Microelectronic Engineering, 2011.06

39

Effect of Thermal Treatment on Adhesion Strength of Cu/Ni-Cr/Polyimide Flexible Copper Clad Laminate Fabricated by Roll-to-Roll Process
Bo-In Noh, Jeong-Won Yoon, Jung-Hyun Choi, Seung-Boo Jung
Microelectronic Engineering, 2011.05

40

Influence of current density on mechanical reliability of Sn-3.5Ag BGA solder joint
Sang-Su Ha, Ji-Yoon Sung, Jeong-Won Yoon, Seung-Boo Jung
Microelectronic Engineering, 2011.05