A novel approach for scratch detection and study on dependency of scratches during oxide CMP

Evaluation of Hydrophobic Films for High Sensitive and Self Aligning Micro Array Protein Chip

Effect of polish by-products on chemical mechanical planarization defects

Convective Assembly and Dry transfer of Nanoparticles Using Hydrophobic/Hydrophilic Monolayer Templates

SAM Modification of CMP Conditioner for the Prevention of Particle Adhesion

Investigation of physical cleaning process window by atomic force microscope

Effect of Laser Shock Wave Cleaning Direction on Particle Removal Behavior at Trenches

Reevaluation of Hydrogen Gas Dissolved Cleaning Solutions in Single Wafer Megasonic Cleaning

Development of inlaid electrodes for whole column electrochemical detection in HPLC

Effect of pH in Ru Slurry with Sodium Periodate on Ru CMP