Large scale directed assembly of nanoparticles using nanotrench templates

The Pad Recovery as a function of Diamond Shape on Diamond Disk for Metal CMP

Experimental and Analytical Study of Submicrometer Particle Removal from Deep Trenches

Interfacial and Electrokinetic Characterization of IPA Solutions Related to Semiconductor Wafer Drying and Cleaning

Experimental and Numerical Investigation of Nanoparticle Removal Using Acoustic Streaming and the Effect of Time

Dishing and Erosion Evaluation of Tungsten CMP Slurry in the Orbital Polishing System

Fabrication and Characterization of an Antistiction Layer by PECVD(Plasma enhanced chemical vapor deposition)

Fabrication of Nano- and Micro-Scale UV Imprint Stamp Using Diamond-Like Carbon Coating Technology

Fabrication of PMMA Micro CE Chip Using IPA Assisted Low-temperature Bonding

Effects of Patterns on Corrosion in Cu CMP