Effect of a guard-ring on the leakage current in a Si-PIN X-Ray detector for a single photon counting sensor

Effect of Sodium Periodate in Alumina-Based Slurry on Ru CMP for Metal.Insulator.Metal Capacitor

Effect of Corrosion Inhibitor, Benzotriazole, in Cu Slurry on Cu Polishing

The Effect of Hydrogen Peroxide in a Citric Acid Based Copper Slurry on Cu Polishing

Nanoparticle Scanning and detection on flat and structured surfaces using fluorescence microscopy

Chemical and Nanomechanical Characteristics of Fluorocarbon Thin Films Deposited by Using Plasma Enhanced Chemical Vapor Deposition

Effect of Polish By-Products on Copper Chemical Mechanical Polishing Behavior

The Effect of Frictional and Adhesion Forces Attributed to Slurry Particles on the Surface Quality of Polished Copper

The Deposition and Characterization Layer for Nanoimprint Lithography by VSAM (Vapor Self Assembly Monolayer)

Evaluation of Al CMP Slurry based on Abrasives for Next Generation Metal Line Fabrication