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191
Metrology and Removal of Nanoparticles from 500 micron Deep Trenches
박진구, 0, 0, 0
SOLID STATE PHENOMENA, 2005
192
Laser Shock Removal of Nanoparticles from Si Capping Layer of Extreme Ultraviolet Lithography Masks
박진구, 0, 0, 0, 0, 0, 0, 0
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES &, 2005
193
Fabrication of a Patterned Replica by Hot Embossing on Various Thicknesses of PMMA
박진구, 0, 0, 0
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2005
194
Particle Adhesion and Removal on EUV Mask Layers During Wet Cleaning
박진구, 0, 0, 0, 0, 0, 0, 0
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES &, 2005
195
Effect of Cerium Ammonium Nitrate and Alumina Abrasive Particles on Polishing Behavior in Ruthenium Chemical Mechanical Planarization
박진구, 0, 0, 0, 0
전기전자재료학회논문지, 2005
196
Fabrication of Hot Embossing Plastic Stamps for Microstructure
박진구, 0, 0, 0, 0, 0
한국재료학회지, 2005
197
Optimizing the Plasma Deposition Process Parameters of Antistiction Layers using a DOE(Design of Experiment
박진구, 0, 0, 0, 0, 0
한국재료학회지, 2005
198
Effects of Hydrogen Peroxide(H2O2) on Frictional and Thermal Characteristics during Cu CMP
박진구
Proceeding of CMP-MIC, 2005
199
The adhesion of abrasive particle and organic residues during STI and Poly-silicon CMP
박진구
PacRim-CMP 2005, 2005
200
Experimental and Modeling Study of Submicron Particle Removal from Deep Trenches
박진구
Proceeding of CMP-MIC, 2005
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