Effect of Corrosion inhibitor, Benzotriazole(BTA), on Particle Adhesion in Cu CMP

Nanotribological Behavior of Cu Oxide and Silicon Tip

Effect of Slurry Chemistry on Cu CMP and Defects

Effect of corrosion inhibitor (BTA) in Cu slurry on Cu polishing

Characterization of the Aluminum and PMMA CMP(chemical mechanical polishing) for transparent plastic display

Nanotribological behavior of Cu oxide with silicon tipoxide with silicon tip

The Effects of Chemicals in Post Cu CMP Cleaning Solutions on Silica and Alumina Particle Adhesion and Removal

The Effects of pH Adjustors in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal

Nanoscale Particles Removal on an Extreme Ultra-Violet Lithography(EUVL) Mask Layer by Lasershock Cleaning

Effects of Corrosion inbibitor, 1H-Benzotriazole(BTAH), on Particle Adhesion in CU CMP