발행물

논문
특허
저서
컨퍼런스

전체 논문

323

261

Calculation and Measurement of Interactive Force Between Slurry Particles and Wafers
박진구, 0
국제Proceeding, 2002

262

Particle Removal and Its Mechanism on Hydrophobic Silicon Wafer in Highly Diluted NH4OH Solutions with an Added Surfactant
Park, JG, Lee, SH, Kim, SY
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES &, 2001

263

The Effects of Additives in Cu CMP Slurry on Polishing
박진구, 0, 0, 0
마이크로전자 및 패키징학회지, 2001

264

Physical and Chemical Characterization of Recycled Oxide CMP Slurry
박진구, 0, 0
마이크로전자 및 패키징학회지, 2001

265

THE STATE-OF-THE-ART IN CMP TECHNOLOGY
박진구, 0
International Journal of the Korean Society of Precision Engineering, 2001

266

Comparative Analysis of Nanotribological Characterization of Fluorocarbon Thin Film by PECVD and ICP
박진구, 0, 0, 0
마이크로전자 및 패키징학회지, 2001

267

The Characterization of Reused Oxide Chemical Mechanical Planarization Slurry
박진구, 0, 0, 0
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001

268

Characterization of Fluorocarbon Thin Film Deposited by PECVD
박진구, 0, 0, 0
마이크로전자 및 패키징학회지, 2001

269

Effect of Orgnaic Acids in Slurry on Cu CMP
박진구, 0, 0, 0
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001

270

Nanotribological Characterization of Fluorocarbon Thin Film by Plasma Enhanced CVD
박진구, 0, 0, 0
마이크로전자 및 패키징학회지, 2001