발행물

논문
특허
저서
컨퍼런스

전체 논문

323

241

Analysis of the Sub Pad effects on the Edge in CMP
박진구
2003 Proceedings of 8th International CMP-MIC, 2003

242

The Adhesion and Removal of Silica Particles on Cu Substrates During Cu CMP
박진구
Proceedings of 26th Annual Metting of The Adhesion Society, 2003

243

Physical and chemical characterization of new ceramic CMP conditioner
박진구, 0, 0, 0, 0, 0
KEY ENGINEERING MATERIALS, 2003

244

Point of Use Regeneration of Oxide Chemical Mechanical Planarization Slurry by Filterations
Kim MS, Woo SW, Park JG, Jin-Goo Park, 0
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES &, 2002

245

Physical and Chemical Characteristics of Ceramic Conditioner in Chemical Mechanical Planarization
박진구
Advances in Abrasive Technology V, 2002

246

Surface Modification of Micromolds by Fluorocarbon Films
박진구
Micro Total Analysis System 2002, 2002

247

Passivation and Etching of Wafer Surfaces in HF-H2O2-IPA Solutions
박진구, 0, 0
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES &, 2002

248

The Effect of Mechanical Properties of Polishing Pads on Oxide CMP
박진구
The second Asia international conference on tribology, 2002

249

Effect of H2O2 and IPA addition in dilute HF solutions on surface etching and particle removal efficiency
박진구
7th international symposium on cleaning technology in semiconductor device manufacturing, 2002

250

A new approach for study of particle adhesion and removal relevant to post Cu CMP cleaning
박진구
7th international symposium on cleaning technology in semiconductor device manufacturing, 2002