발행물

전체 논문

323

231

레이저 충격파 클리닝 공정에 있어 자외선의 영향
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한국레이저가공학회 2004년도 춘계학술발표대회 논문개요집, 2004

232

Chemical Mechanical Planarization of Ruthenium for capacitor bottom electrode in DRAM Technology
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Electrochemical Society Proceeings, 2004

233

Post CMP Cleaning: from Fundamentals to Future Direction
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CMP-MIC, 2004

234

Chemical and Mechanical Characterizations of the PassivationLayer of Copper in Organic Acid Based Slurries and its CMP Performance
박진구, 0, 0, 0, 0
KEY ENGINEERING MATERIALS, 2004

235

3D Numerical Study for a Polishing Behavior on Oxide CMP (Chemical Mechanical Planarization)"
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KEY ENGINEERING MATERIALS, 2004

236

Wafer Cleaning Efficiency by Laser Shock Wave
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Microelectronics and Packaging, 2003

237

Si Wafer Surface Cleaning Using Laser-Induced Shock Wave: A New Dry Cleaning Methodology
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SURFACE & COATINGS TECHNOLOGY, 2003

238

Interaction Forces between Silica Particles and Wafer Surfaces During Cu Chemical Mechanical planarization
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JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003

239

Nano Mold fabrication for imprinting lithography
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Korea Society of Mechanical Technology, 2003

240

Laser Shock Removal of Micro and Nanoscale Particles
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Proceedings of 26th Annual Metting of The Adhesion Society, 2003