Fabrication of large area metal lines on plastic substrates by hot embossing and CMP(chemical mechanical polishing)

Roll of anti-stiction layers in NIL(nanoimprinting lithography)

Fabrication of metal line on plastic substrate by hot embossing and CMP process

Polishing Behavior and Characterization of Cu Surface in Citric Acid based Slurry with Corrosion Inhibitor(BTA)

The Deposition and Characterization of 10nm Thick Teflon-like Anti-stiction Films for the Hot Embossing

Fabrication of plastic CE(capillary electrophoresis) microchip by hot embossing process

Adhesion and Removal of Alumina Slurry Particles on Wafer Surfaces in Cu CMP

Cu CMP Slurry

Wafer-level Fabrication of Plastic Capillary Electrophoresis Microchip by Hot Embssing Process

The Effect of Additives in Post Cu CMP Cleaning on Particle Adhesion and Removal