발행물
컨퍼런스
Asian Workshop on Planarization/CMP Technology
2021
,
Studies on galvanic coupling of W and Ti/TiN during W post-CMP cleaning
The Surface Preparation and Cleaning Conference 2021 (SPCC 2021)
Effect of power and surfactant on the behavioral of bubbles in an ultrasonic field
Effect of slurry additives on Co-BTA complex stability and inhibition property during Co CMP process
Effect of skin layer on brush loading, cross-contamination, and cleaning performance during post CMP cleaning
An Analysis Method of the Wetting Characteristic of High Aspect Ratio Structure