발행물
컨퍼런스
2018 International Conference on Planarization/CMP Technology
2018
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Adhesion and Removal Behavior of Contaminants from Polyvinyl Acetal (PVA) Brush during Post CMP Cleaning Process
Optimization of CVD process for CVD conditioner with improved performance
Quantitative and Qualitative Kinetic Analysis of Single, Double and Triple Slurry Components for Cu CMP
In-situ Measurement of Cu-Inhibitor Complex Layer by AFM
Nanocatalyst Induced Hydroxyl Radical (·OH) for Removal of Tungsten (W) in Chemical Mechanical Polishing