발행물
컨퍼런스
THE SURFACE PREPARATION AND CLEANING CONFERENCE 2019 (SPCC)
2019
,
Effect of Bubble on Particle Agglomeration in Tungsten (W) CMP Slurry
The 26th Korean Conference on Semiconductors
Critical Nanotopography Metrology Study for Good CMP Process Control and Electrical Bonding Yield in Wafer-To-Wafer Hybrid Bonding
Removal of Particulated Contaminants from Backside of EUV Mask Using Dry Cleaning
Removal of EUV Exposed Hydrocarbon from Ru Capping Layer of EUV Mask Using the Mixture of Alkaline Solutions and Organic Solvents
The 28th Cleaning Technology Symposium of Korea SCUGM
2018
Removal of CrN Contamination from EUV Mask Backside using Dry Cleaning