2005

,

Wafer level Hot Embossing of Device patterns on PMMA wafer

2005

,

Cu CMP 공정 중의 연마입자 부착력과 마찰력 특성 평가

2005

,

Removal of Particles and Metal Impurities by adding of Chelating Agent onto SC1 Cleaning Solution in Semiconductor Wet Cleanging Process

2005

,

Fabrication of stamps using the high temperature epoxy resins for hot embossing

2005

,

Effect of Corrosion Inhibitor(BTA) on Citric Acid based Slurry on Cu CMP