발행물
컨퍼런스
27th Ko-CMPUGM
2005
,
The Adsorption behavior of Citric acid on Colloidal silica and Alumina particle in Cu CMP Slurry
MRS, Spring meeting
Effect of Corrosion Inhibitor (BTA) in Citric Acid Based Slurry on Cu CMP
MRS
The Adhesion of Pad Particles on Wafer surface during Cu CMP
Frictional Behavior and Particle Adhesion of Abrasive Particles during Cu CMP
2004 한국재료학회 추계학술발표대회
2004
나노미터 두께를 가지는 Hot Embossing 용 점착방지막의 열적 안정성 특성평가