Effects of H2O2 and pH on the Chemical Mechanical Planarization of Molybdenum

Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Mechanisms of colloidal ceria contamination and cleaning during oxide post CMP cleaning

Effect of Surfactant in Gas Dissolved Cleaning Solutions on Acoustic Bubble Dynamics

Mechanism of PVA Brush Loading with Ceria Particles during Post-CMP Cleaning Process

Formulation and Evaluation of Diluted Sulfuric-Peroxide-HF (DSP+) Mixtures for Cleaning High-Aspect Ratio Contacts in 3D NAND

The Effect of Thermal Aging on Nano-Particle Removal

Effect of Dissolved Oxygen on Removal of Benzotriazole from Co during a Post-Co CMP Cleaning

Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers

Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process