Removal of UV-cured resin using a hybrid cleaning process for nanoimprint lithography

The impact of diamond conditioners on scratch formation during chemical mechanical planarization (CMP) of silicon dioxide

Wafer-scale nanowell array patterning based electrochemical mpedimetric immunosensor

Shockwave-induced deformation of organic particles during laser shockwave cleaning

Quantitative Analysis of H5N1 DNA Hybridization on Nanowell Array Electrode

Hybrid Cleaning Technology for Enhanced Post-Cu/Low-Dielectric Constant Chemical Mechanical Planarization Cleaning Performance

Investigation of Source-Based Scratch Formation During Oxide Chemical Mechanical Planarization

On the mechanism of material removal by fixed abrasive lapping of various glass substrates

Fluorocarbon film-assisted fabrication of a CoNi mold with high aspect ratio for nanoimprint lithography

Modification of Diamond Conditioner with V-SAM Coatings for Corrosion Prevention During Metal CMP