Investigation of oxide layer removal mechanism using reactive gases

Effect of lanthanum doping in ceria abrasives on chemical mechanical polishing selectivity for shallow trench isolation

Novel one-step route to induce long-term lotus leaf-like hydrophobicity in polyester fabric

Effect of FOUP atmosphere control on process wafer integrity in sub20nm device fabrication

Characterization of Cu-BTA Organic Complexes on Cu during Cu CMP and Post Cu Cleaning

Characterization of non-amine-based post-copper chemical mechanical planarization cleaning solution

Effect of La doping of ceria abrasives for STI CMP

Effect of dissolved gases in water on acoustic cavitation and bubble growth rate in 0.83 MHz megasonic of interest to wafer cleaning

Abrasive and additive interactions in high selectivity STI CMP slurries

Effect of Silicon Dioxide Hardness on Scratches in Interlevel Dielectric Chemical-Mechanical Polishing