Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process

Characterization of Different Cobalt Surfaces and Interactions with Benzotriazole for CMP Application

Nanocatalyst-induced hydroxyl radical ((OH)-O-center dot) slurry for tungsten CMP for next-generation semiconductor processing

Hybrid DHF and N-2 jet spray cleaning for silicon nitride and metal layer DRAM patterns

Investigation of particle agglomeration with in-situ generation of oxygen bubble during the tungsten chemical mechanical polishing (CMP) process

Ultrasound-induced break-in method for an incoming polyvinyl acetal (PVA) brush used during post-CMP cleaning process

Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning

A Breakthrough Method for the Effective Conditioning of PVA Brush Used for Post-CMP Process

Selection and Optimization of Corrosion Inhibitors for Improved Cu CMP and Post-Cu CMP Cleaning

Post-CMP Cleaning of InGaAs Surface for the Removal of Nanoparticle Contaminants for Sub-10nm Device Applications