발행물
컨퍼런스
2017 International Conference on Planarization/CMP Technology
2017
,
Development of Post InGaAs CMP Cleaning Process for sub 10nm Device Application
Optimization of WC-Co Composition for CVD Diamond Pad Conditioner
Chemical Generation Mechanism of Copper Flake Defects on Copper Wafer Surface from CMP Slurry and Post CMP Cleaning Chemistry
Optimization of Cu Corrosion Inhibitor Concentration to Reduce Organic Defects
Evaluation of Competitive Reaction of Various Cu CMP Slurry Components