발행물
컨퍼런스
2016 International Conference on Planarization/CMP Technology
2016
,
Effect of Cleaning Chemicals on PVA Brush for Post CMP Cleaning
Post CMP Surface Preparation in sub 10nm device (Invited)
Effect of Corrosion Inhibitors on Particle Contamination and Removal for Cu CMP Application
Cross-Strait and Asia-Pacific Conference on Planarization/CMP Technology 2016
Challenges on wafer cleaning and post CMP cleaning in 10 nm below device fabrication (Keynote Speech)
2016년도 한국재료학회 춘계학술대회
Fabrication of Bumping Mask using Through Mask Electrochemical Micro Machining (TMEMM)